Photonic Integrated Circuits (PIC), functions analogous to electronic ICs, utilizes photons instead of electrons to carry data. Photons, unit of light, travels comparably much faster than other data carriers, hence data transfer speed has increased dramatically. Global photonic ICs market is expected to rise at a remarkable rate as it offers substantial enhancements in system size, power intake, cost, and dependability.
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On the basis of uses, the global photonic IC market is segmented into biophotonics, optical communication, sensors, optical signal processing and nanophotonics. The global photonic IC market is further segmented on the basis of integration methods deployed into monolithic integration, hybrid integration, and module integration. In addition, the global photonic IC market is segmented on the basis of components, namely: modulators, lasers, multiplexers/de–multiplexers, detectors, optical amplifiers and others (such as attenuators, wavelength converters, etc.). The market is segmented on the basis of materials, namely: lithium niobate (LiNbO3), indium phosphide (InP), silicon (Si), gallium arsenide (GaAs), and silica–on–silicon.
Ongoing limitation of electronic ICs in search of adding more transistors over a single silicon substrate has pressured the industry to invent a substitute. Furthermore, existing principal players have developed monolithically combined InP-based photonic ICs that assimilates more than 600 components/utilities in a single chip. As a result, there is an enormous competition in the marketplace as every single player is aiming at inventing photonic IC-based products which would be capable of integrating large quantities of functions/utilities at low cost. Budget and magnitude saving accomplished by integrating diverse optical modules, including modulators, detectors, and lasers, into a single package is...