Anti-Counterfeit Packaging Market by Technology

Anti-Counterfeit Packaging Market by Technology

““Increasing focus of manufacturers on brand protection to drive the anti-counterfeit packaging market.”
The global anti-counterfeit packaging market size will grow from USD 82.05 billion in 2015 to reach USD 153.95 billion by 2020, at a projected CAGR of 13.41%. Increasing concern for brand protection, the need for managing an efficient supply chain, and rising counterfeit products in the market are factors encouraging manufacturing to use anti-counterfeit technologies.

“Use of RFID technology in the pharmaceuticals & healthcare sector projected to increase during the forecast period.”
The pharmaceuticals & healthcare sector is projected to be the fastest-growing end-use sector in the next five years. Due to stringent laws & regulations enacted by the government and increasing importance given to package security by manufacturers, the demand for anti-counterfeit packaging technologies is projected to grow in this sector.
“North America dominated the anti-counterfeit packaging market, in 2020”
North America held the largest share in the anti-counterfeit packaging market and is projected to dominate the market during the forecast period. Whereas, the market for Asia-Pacific is projected to grow at the highest CAGR. Rise in counterfeit products present in the market, increasing brand awareness, awareness among buyers about product information, the growing e-commerce industry, developments in printing technologies, and concerns regarding the impact of counterfeit products on the brand image of genuine product is driving the anti-counterfeit packaging market.

Breakdown of Primaries:
Primary interviews were conducted with a number of industry experts in order to collect data related to different aspects of the anti-counterfeit packaging market. Primary sources include professionals such as opinion leaders, executives, vice presidents, and CEOs of companies in the packaging, anti-counterfeit, and labeling industries. The following is the breakdown of...

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